Technical Articles

The use of soldermask to define pads, especially in Ball Grid Arrays, is often mis-understood. This article discusses the relevant IPC standards.

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Adding layers of predominantly filled copper to a printed circuit board is common-place these days. This article introduces the concept and discusses many of the considerations for the use of plane layers.

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The use of power and ground planes in the stack-up, can greatly improve the EMI/EMC performance providing certain rules are followed, such as burying the most sensitive signals on the inner layers and providing close coupling to the nearest plane or better still, a pair of planes. This article gives you a brief insight into some of the techniques available to you and brings into focus some of the key constraints to consider.

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The vast majority of customers we meet are interested in Design Reuse. 
The key is to make it easy to do the easy bits so that you can focus on the difficult bits. There are lots of features within Altium Designer that can help here but before you can use them efficiently, you might need to do some preperation first.

Take a look at our Design Reuse Technical Article for more information.

 

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